we lost one aspect of moores law. we stopped making bigger silicon wafers. it means we lost one axis of cost reduction that used to be easy to tug on. it means we need more and bigger factories to keep up with demand, and there is some cost associated. we are at the dawn of 3d packaging. we are at the dawn of heterogeneous material composition (think processor made of different material chiplets (high frequency chiplets, high power chiplets, high efficiency chiplets, photonics etc..). we will achieve many orders of magnitude improvements in real computing power for a long time to come, but it won't always be cheap.