Submitted by gingerisdeadinside t3_1162bnv in headphones
So, everyone knows that open backs generally creates a wider soundstage than closed backs, with the main caveat being sound leak. What would happen if I 3D printed some snap on grill covers for my pair of Senheiser HD560s?! My Train of thought is: if I wanted to travel on a bus or train with the HDs, it would stop the sound leak from bothering the other people around me. Since the impedance is quite high @ 125 Ohms, it's really efficient and takes low power to drive from my lightning to Dragonfly headphone DAC. I'd think even with the lack of airflow, it wouldn't overheat the drivers. Since this is an extremely flat and analytical headphone for the price, the lack of airflow wouldn't effect the bass that much? I'm probably gonna get ripped to shreds by more experienced audiophiles for even asking this, but am genuinely curious... (I'd place rubber seals around the plastic plate to create a nearly airtight seal)
rimrink t1_j94p6b6 wrote
If you haven't tried covering the grills with your hands yet, you should try it, to discover how bad it will sound.