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Golfer345 OP t1_j9qh23h wrote

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Terminator857 t1_j9qi0z4 wrote

Microchips of the past were mostly 2d. Like a printed circuit board. Today and more in the future they are more 3 dimesional, like a circuit board that has circuits at multiple levels. If my memory and understanding is correct, current state of the art flash memory chips are 100 levels deep. Can we make that a 1000? CPU chips aren't taking advantage as much of this multi level architecture. Same with GPU (graphic processor units) or TPU (tensor processing units) chips.

3d comes in multiple flavors. Here is an example of stacking the chips: https://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit

An analogy is cities. Today's cities are mostly 2d. Traffic happens at the ground level. In the future we will have cities were commuting can occur at multiple vertical levels and we can call them 3d cities.

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Golfer345 OP t1_j9qleef wrote

Whoa just like as in the movie Minority Report lol!! (The movie depicts vertical commuting as you called it)

Oh ok thanks , that was a good explanation. That Wikipedia article came up when I googled my question but I wasn’t sure if the article was relevant or not

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